Friday, 17 July 2015

Thermal Engineer Intel - Washington Court House, OH, US

The System Architecture team is seeking an experienced Thermal Engineer with a background in electronics cooling. The System Architecture team designs board and system for reference platforms and commercial server systems. Typical systems can be single socket, multi-socket and multi-node designs in Rack and Pedestal system form factors. Search Internet for images of 1U and 2U servers for examples.

You will join a dynamic and fast paced environment with a team of experienced engineers and mentors. The Thermal Engineer is a key contributor in the system architecture process and responsibilities include path finding, development and validation of system level cooling solutions for Intel processor based server systems through both simulation and testing. You will work with other Engineers and Architects to support multiple platforms with traditional and advanced cooling technologies to meet the thermal challenges of increasing power density and power/performance requirements on future servers. The thermal design process covers all aspects of system cooling including design optimization, component placement, airflow/ducting requirements, fan speed control algorithms, component heat sink designs and design tradeoffs.

The System Architecture team is seeking an experienced Thermal Engineer with a background in electronics cooling. The System Architecture team designs board and system for reference platforms and commercial server systems. Typical systems can be single socket, multi-socket and multi-node designs in Rack and Pedestal system form factors. Search Internet for images of 1U and 2U servers for examples.

You will join a dynamic and fast paced environment with a team of experienced engineers and mentors. The Thermal Engineer is a key contributor in the system architecture process and responsibilities include path finding, development and validation of system level cooling solutions for Intel processor based server systems through both simulation and testing. You will work with other Engineers and Architects to support multiple platforms with traditional and advanced cooling technologies to meet the thermal challenges of increasing power density and power/performance requirements on future servers. The thermal design process covers all aspects of system cooling including design optimization, component placement, airflow/ducting requirements, fan speed control algorithms, component heat sink designs and design tradeoffs.

Minimum Qualifications
Bachelor of Science Degree in Mechanical Engineering
Academic emphasis with heat transfer
  • + years of experience in heat transfer
  • + years of experience with thermal simulation software (such as Flotherm* or Icepak*)
  • + years of hands on experience with thermal testing
  • Additional Desired Qualifications
    Master of Science degree in Mechanical Engineering
    Minor in Mathematics
  • + years of experience specific to electronics cooling
  • + year of experience with Acoustic testing
  • Technical report writing experience
    Knowledge of computer server systems and Data Centers
    Demonstrated skills in problem solving
    Working knowledge of Pro/e
  • + year experience with statistical methods such as Monte-Carlo simulation
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