Package Design Engineer Micron Technology - Singapore, SG

Job Description
As a Package Design Engineer at Micron Semiconductor Asia, you will be providing package designs for advanced semiconductor packages. You will be working with a cross-function team across several geographies and sites to create package design databases such as package stack-up, simulation, route-study, substrate/leadframe layout, wirebond diagrams, and other design documentation.

 

You will be required to complete design activities within the project schedule and ensure design outputs are able to meet assembly rules and vendor capability.

 

Other Package Design Engineering job responsibilities include ability to perform basic electrical/thermal simulation tasks of advanced electronic packages

 

Responsibilities
Design Coordination and Management

• Support feasibility studies for various package options.
• Interact with and support die design to enable silicon architecture development.
• Interact with key Business Unit stakeholders and recommend package solutions to meet customer and/or market requirements.
• Establish design gap analysis for subcontractor proposals.
• Support package technology development activities.
• Support packaging IP development.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support the design group’s continuous improvement efforts.
• Support global design alignment activities.
• Contribute to package design rule and system development.
• Contribute to package roadmaps.
• Contribute to the Competitive Analysis review process.

 

Create Package Designs

• Support die padslog layout/optimization
• Design for optimum electrical performance, manufacturability, and package reliability
• Perform cross-functional team design reviews (Global Assembly, Test, QA and External Programs)
• Execute interposer supplier design reviews in a timely and efficient manner
• Perform direct design reviews with assembly subcon design teams
• Participate in the DFMEA process

 

Generate Documentation

• Maintain familiarity with documentation work flows and signoff flows
• Ensure accurate and timely update of all documents into the Assembly Database
• Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
• Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams

 

Contribute to a Safe and Compliant Work Environment

• Identify and promptly report hazards
• Follow safety procedures and area work rules
• Use proper lifting techniques and work in an ergonomically correct manner

 

Requirements
 

Desired

• Masters or Bachelors Degree in Mechanical Engineering or Electrical Engineering
• 5 years experience in any of the following: working experience in any of the following: Package design, PCB Design, Assembly process, Assembly materials, Product Engineering, Quality and Reliability
• Proficient in Cadence (SiP Digital Layout or Allegro Package Designer software and System Connectivity Manager)
• Proficient in AutoCAD 2D and 3D (Inventor a plus)

Required

• Masters or Bachelors Degree in Engineering
• 3 years experience in any of the following: working experience in any of the following: Package design, PCB Design, Assembly process, Assembly materials, Product Engineering, Quality and Reliability
• Candidates with no experience are welcome to apply

 

 

• Experienced candidates will be considered for senior position

• Good computer skills and proficient in MS Office
• CAD experience
• Detail orientated
• Strong oral and written communication skills
• Ability to interact and work in a team environment
• Fundamental electrical circuit knowledge
• Ability to read an interpret drawings and schematics
• Ability to prioritize and manage multiple projects
• International travel may be required on a quarterly basis
• Work environment will be office (cubical)
• Shift will be 8+ hour shift, 5 days per week.

 

Working location:
 

Bendemeer Road, Singapore 339942

It has been and will continue to be the policy of Micron to administer all human resource actions and benefits without regard to race, religion, color, sex, national origin, age, disability, sexual orientation, veteran's or other legally-protected status. Each manager, supervisor, and team member is responsible for carrying out this policy.

The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters. To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).